Product Information:-

  • Journals
  • Books
  • Case Studies
  • Regional information
Request a service from our experts.
Microelectronics International

Microelectronics International

ISSN: 1356-5362

This journal is a Hybrid Open Access journal
Full text online
Content: Table of Contents  
Information: Journal information  |  Editorial Team  |  Author Guidelines
Other:  |  Recommend this journal

2018 Impact Factor: 0.840*
5-year Impact Factor (2018): 0.727*

CiteScore 2020: 1.6
CiteScoreTracker 2021: 1.6 (Updated Monthly)

Journal history

Previously published as Hybrid Circuits
Follow the Table of Contents link above for previous content.

Aims & Scope

Microelectronics International provides an authoritative, international and independent forum for the critical evaluation and dissemination of research and development, applications, processes and current practices relating to advanced packaging, micro-circuit engineering, interconnection, semiconductor technology and systems engineering. It represents a current, comprehensive and practical information tool. The Editor, Dr John Atkinson, welcomes contributions to the journal including technical papers, research papers, case studies and review papers for publication. Please view the Author Guidelines for further details.

Key benefits

The journal comprises a multi-disciplinary study of the various technologies, processes and current practices associated with the design, manufacture, assembly and various applications of miniaturized electronic devices and advanced packages.

Key journal audiences

Microelectronics International represents a comprehensive and authoritative information source for research, application and current awareness purposes for researchers, senior technical staff and practising engineers within industry and researchers and academics within universities.


Microelectronics International comprises a multi-disciplinary study of the key technologies and related issues associated with the design, manufacture, assembly and various applications of miniaturized electronic devices and advanced packages. Among the broad range of topics covered are:

  • Advanced packaging 
  • Ceramics 
  • Chip attachment
  • Chip on board (COB)
  • Chip scale packaging
  • Flexible substrates
  • MEMS
  • Micro-circuit technology
  • Microelectronic materials
  • Multichip modules (MCMs)
  • Organic/polymer electronics
  • Printed electronics
  • Semiconductor technology 
  • Solid state sensors
  • Thermal management
  • Thick/thin film technology
  • Wafer scale processing

Microelectronics International is indexed and abstracted in:

  • Academic Source Complete
  • CSA Engineering Research Database
  • CSA High Technology Research Database with Aerospace
  • CSA Materials Research Database with METADEX
  • CSA Technology Research Database   
  • EI Compendex
  • Journal Citation Reports/Science Edition
  • Norwegian Register for Scientific Journals
  • ProQuest Science Journals
  • ReadCube Discover
  • Recent Advances in Manufacturing Database (RAM)
  • Referativnyi Zhurnal 
  • TOC Premier
  • Zetoc

And ranked in:

  • Science Citation Index Expanded SCIE (Clarivate Analytics)
  • Scopus


Microelectronics International is available as part of an online subscription to the Emerald Engineering eJournals Collection. For more information, please email or visit the Emerald Engineering eJournals Collection page.

COPE logo.
This journal is a member of and subscribes to the principles of the Committee on Publication Ethics. More on Emerald's approach is available in our Publication Ethics guidelines.

* 2018 Journal Citation Reports® (Clarivate Analytics, 2019)